Mod5 Series flip-top BGA socket requires no tooling or mounting holes, maximizing PCB real estate while reducing costs. For test, debug, and validation of 0.5-mm pitch BGA devices, the Mod5 Series ...
Ironwood Electronics introduced a new high-performance elastomer socket for 0.5-mm-pitch ball-grid-array (BGA) packages. The CG15-BGA-1003 socket is designed for a 10- x 5.7-mm package size. It ...
Over the past several years, the speed and functionality of IC devices have continually increased. These changes have been accompanied by new package styles featuring higher I/O pin counts with ...
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