MOUNTAIN VIEW, Calif.--(BUSINESS WIRE)--Diamond Quanta today announced Adamantine Thermal™, an engineered-diamond thermal platform designed for integration into advanced packaging workflows and ...

The 2026 IEEE Electronic Components and Technology Conference (ECTC) showcased how advanced packaging can redefine the scalability limits of artificial intelligence (AI) and high-performance computing ...

Chiplets have generated a lot of interest in recent years as design engineers look for alternatives to traditional system-on-chip technology to house complex, multi-function electronics. At the ...

Amkor Technology (NASDAQ:AMKR) outlined a multi-year growth strategy centered on advanced semiconductor packaging, saying the technology has moved from a back-end manufacturing step to a critical part ...

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

The U.S. Department of Commerce today announced the launch of a new federal funding competition that aims to spur the research and development of more advanced computer chip packaging technologies.

Discover how heat resistant materials and material science innovations help electronics manufacturing manage rising temperatures, boost reliability, and enable smaller, more powerful next‑generation ...

Electronic Vehicles (EVs) have been at the center of attention in recent years. With the automotive industry becoming more aligned with sustainable development goals, the focus has shifted toward EVs ...

Advanced semiconductor packaging technologies are crucial due to the slowing of Moore's law and rising costs of monolithic Si IC development and manufacturing. Initially, components were individually ...