IC packaging, typically an afterthought in the design of a new-generation SoC, is particularly troublesome for communications circuits and high-speed interface circuits. Everyone wants small size and ...
The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...
The female SF-BGA1152A-B-42 socket and the LS-BGA1152A-41 ball-grid-array (BGA) surface-mount (SMT) male pin unit serve as a low-cost and reliable adapter set for Xilinx's 1152-pin BGA ICs. The ...
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