Housed in a 3 x 3 mm QFN package with ESD protection on all pins, the RF2861 single-band, front-end receiver also integrates a TX LO buffer amplifier. Designed for CDMA, JCDMA and CDMA450 applications ...
The advanced SiP double-sided molded BGA platform has become an industry technology standard in this domain. Applying leading-edge design rules for 3D component placement and double-sided molding, ...
Despite intense worldwide activity, 5 GHz OFDM-WLAN remains an emerging technology. And, due to its immaturity, designers have some big steps to make on the integration front. One area where ...