The global advanced IC substrate market is poised for significant growth, according to recent industry reports. Global Information, Inc. (GII) projects the market to reach US$18.11 billion in 2024 and ...

The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...

Image transfer, also known as photolithography (or simply, lithography), plays a crucial role in defining the circuit patterns on a panel. With photolithography, IC substrate manufacturers can ...

The plastic Ball Grid Array (BGA) and Low profile Fine pitch BGA (LFBGA) packages have developed over recent years from being rarely used devices, to become, for many applications, the first choice ...

Simple and inexpensive semiconductor devices in earlier generations of electronic systems were easily discarded or recycled when they were damaged either before or during the printed circuit board ...

Fueled by booming demand for advanced packaging like CoWoS, a new report from China’s Wallstreetcn is turning heads with claims of a breakthrough “CoWoP” (Chip on Wafer on PCB) tech—mounting chips ...