E-beam inspection is gaining traction in critical areas in fab production as it is becoming more difficult to find tiny defects with traditional methods at advanced nodes. Applied Materials, ASML/HMI ...

Korean researchers have developed a new analysis method capable of detecting “hidden defects” in semiconductors with a ...

SAN JOSE — Moving to boost yields in advanced IC production, KLA-Tencor Inc. today (June 11) unveiled its latest electron-beam inspection tool for “electrical line monitoring” applications. The eS30 e ...

FREMONT, CA--(Marketwired - Sep 29, 2014) - Today DCG Systems®, Inc. announced the first installation of the Meridian™ WS-DP (WaferScan Direct Probe) at NVIDIA, a leading manufacturer of graphics ...

Chipmakers are plotting out a strategy to scale the transistor to 10nm and beyond. Migrating to these nodes presents a number of challenges, but one issue is starting to gain more attention in the ...

Applied Materials rolled out a new optical inspection system that uses big data and artificial intelligence to spot mistakes in memory and computer chips faster and more economically. Chip-making is ...

There is an expectation from consumers that today’s electronic products will just work and that electronic manufacturers have continued to improve the quality of their products. In most cases, this ...

Improving baseline yields and speeding yield learning are always issues in semiconductor manufacturing. Addressing those problems may have just gotten a little easier for defect and yield engineers ...