IIIF provides researchers rich metadata and media viewing options for comparison of works across cultural heritage collections. Visit the IIIF page to learn more. Maximilian Berktold (b. 1929) ...
Why co-optimization is needed when designing 2.5D and 3D chips. The tools provided by Siemens for 2.5D and 3D chip design and packaging. The latest high-performance chips often employ 2.5D and 3D chip ...
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