Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...
Smart phones are a rapidly growing share of mobile phone shipments, representing 15% of the market in 2009 and growing to 35% in 2013. Essentially all the growth in mobile phone sales will come from ...
A panel-level (PL) approach to fan-out (FO) packaging has been discussed for several years to reduce the cost of chip-first FO packaging based on redistribution layer (RDL) technology. More recently, ...
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