The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...

SPHBM4 cuts pin counts dramatically while preserving hyperscale-class bandwidth performanceOrganic substrates reduce packaging costs and relax routing constraints in HBM designsSerialization shifts ...

HANMI Semiconductor will supply SK hynix with the "TC bonder" (thermocompression bonder), a core high-bandwidth memory (HBM) ...

TL;DR: SK hynix will showcase its AI memory technologies at CES 2025, featuring solutions for on-device AI and next-generation AI memories. The company aims to highlight its technological ...

TL;DR: SK hynix will showcase its new 16-Hi HBM3E memory chips at CES 2025, featuring up to 48GB capacity. These chips use an advanced manufacturing process to enhance performance and control warpage.

SEOUL, Jan. 14 (Yonhap) -- SK hynix Inc. has ordered new high bandwidth memory (HBM) production equipment from Hanmi ...

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If you’ve noticed that your next smartphone, laptop, or PC upgrade suddenly costs noticeably more than it did a year ago, you ...

SK Hynix (or "the company") announced today that it will showcase its innovative AI memory technologies at CES 2025, to be held in Las Vegas from January 7 to 10 (local time). A large number of ...