JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.
When we talk about the cost of AI infrastructure, the focus is usually on Nvidia and GPUs -- but memory is an increasingly ...
Samsung has officially announced its new HBM4 memory is one of the first to be 'commercially' shipped, ready for 13Gbps and ...
IEEE Spectrum on MSN
How and when the memory chip shortage will end
Despite new fabs and new technology, prices will stay high ...
TL;DR: Samsung Electronics is intensifying its push into the HBM market by proposing its advanced 12-Hi HBM3E memory for NVIDIA's upcoming Blackwell Ultra GPUs. Building on success with AMD, Samsung ...
Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...
Designed to take on high-bandwidth memory in data centers, Z-Angle memory (ZAM) leverages diagonal interconnects for improved ...
If you want to be in the DRAM and flash memory markets, you had better enjoy rollercoasters. Because the boom-bust cycles in ...
Artificial intelligence (AI) involves intense computing and tons of data. The computing may be performed by CPUs, GPUs, or dedicated accelerators, and while the data travels through DRAM on its way to ...
AI data centres are absorbing memory supply, pushing memory chip prices up. Consequently, consumer devices face higher costs, slower spec upgrades, and a shrinkingmid-range smartphone segment.
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