Summary: To ring in 2026, our 24/7 Wall St. Analysts Eric Bleeker and Austin Smith are counting down 12 trends for AI ...

RBC Capital Markets expects semiconductor revenue stemming from artificial intelligence applications to grow from $220B in ...

Gartner: 2025 semiconductor revenue +21% to $793B on AI chip demand; Nvidia leads as AI spend nears $1.3T in 2026.

Massive hyperscaler capacity buildouts drove up global semiconductor spending by 21% year over year to $793 billion in 2025, ...

By 2026, chips will dominate technology as AI and hardware demands become the primary innovation drivers. Running AI at scale will require massive compute power ...

Neo Semiconductor X-HBM architecture will deliver 32K-bit wide data bus and potentially 512 Gbit per die density. It offering 16X more bandwidth or 10X higher density than traditional HBM. NEO ...

SK Hynix recently announced a major investment in a new South Korean plant. The Icheon-based company will spend $12.9 billion to develop a facility dedicated to advanced ...

With capacity shifting to high-margin HBM for AI data centers, traditional DRAM supply is collapsing, pushing enterprise IT ...

The demand for high bandwidth memory (HBM) is accelerating across the semiconductor industry, driven by boundary-pushing artificial intelligence, high-performance computing, and advanced graphics.

New X-HBM architecture delivers a 32K-bit wide data bus and potentially 512 Gbit per die density, offering 16X more bandwidth or 10X higher density than traditional HBM "X-HBM is not an incremental ...

Companies Sign Memorandum of Understanding to Establish HBF Memory Technology Specification MILPITAS, Calif.--(BUSINESS WIRE)-- Sandisk Corporation (NASDAQ: SNDK) today announced it has signed a ...