As integrated circuit (IC) designs have grown in complexity, scale and speed requirements, design rule checking (DRC) has evolved from a routine step into a critical pillar of successful tapeouts.
The complexity of DRC rules increases with shrinking geometries. It is not that the laws of physics change with shrinking IC feature size; they are just more strictly enforced. At one time, there was ...
Across The Vast Reaches Of The 3D Stack: Mastering ESD Verification In Advanced Semiconductor Design
In the vast reaches of the semiconductor cosmos, a silent menace lurks—one that can obliterate years of design work in a fraction of a nanosecond. Electrostatic discharge (ESD) verification stands as ...
3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...
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