Stacked die and fan-outs gain steam as shrinking features becomes more difficult. Where the biggest hurdles are and what’s being done about them. After a number of false starts and lackluster adoption ...

The shift toward more complex IC packages requires more advanced inspection systems in the production flow to capture unwanted defects in products. This includes traditional optical inspection tools ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

KLA-Tencor Corp. has announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP and ICOS T830. Designed for characterization and monitoring of the diverse processes ...