Telit Wireless Solutions, Inc., an internationally leading specialist in machine-to-machine (M2M) technology, launches HE910, the worldwide smallest module featuring 5-band HSPA+. The module can thus ...
Although LGA (land grid array) and BGA (ball grid array) packaging seem quite similar – LGA packaging is basically BGA packaging without the solder balls – there are some significant differences that ...
Zilog’s Mini-Z ZNEO 28-Pin Module is a 28-pin Dual Inline Pin module designed for the engineer, student and enthusiast to quickly develop prototypes, proofs of concept and demonstrations as well as to ...
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