Several equipment makers are ramping up new inspection equipment to address the growing defect challenges in IC packaging. At one time, finding defects in packaging was relatively straightforward. But ...

CHARLOTTE, N.C. — The IC design and test community's quest to achieve fewer than 100 defective parts per million (DPPM) is becoming more difficult as process technologies move below 100 nanometers.

A defect in a semiconductor chip may be smaller than a human hair but can create big problems in your everyday life, from crippling your car's steering to making your laptop more susceptible to ...

Semiconductor wafer defect pattern recognition and classification is a crucial area of research that underpins yield enhancement and quality assurance in microelectronics manufacturing. The discipline ...

Several vendors are ramping up new inspection equipment based on infrared, optical, and X-ray technologies in an effort to reduce defects in current and future IC packages. While all of these ...

Semiconductors are used in devices such as memory chips and solar cells, and within them may exist invisible defects that ...

The Atomic Force Microscope (AFM) has evolved from an extremely high resolution scientific research instrument into a highly accurate metrology tool. This evolution has broadened the role of the AFM ...

Applied Materials has launched the SEMVision™ H20, a new defect review system designed to enhance the analysis of nanoscale defects in advanced semiconductor chips. This system utilizes cutting-edge ...

Semiconductor process engineers have always understood the need to inspect silicon wafers to identify defects and eliminate them at their source. To simplify the process, semiconductor equipment ...

Formation of defect-pairs in GaN under high-energy particle irradiation. Courtesy: S Chen Gallium nitride (GaN) is the world’s second-favourite semiconductor, present in devices ranging from ...