TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

In recent years there has been a sharp rise of multi-die system designs. Numerous publications targeting a large variety of applications exist in the public domain. One presentation [2] on the IEEE’s ...

(Jan 13): SK Hynix Inc plans to spend 19 trillion won (US$12.9 billion, or $16.58 billion) building a new advanced chip ...

This highly optimized multi-chip packaging platform was designed from the ground up with the recently announced Marvell custom HBM and CPO solutions in mind. Taken together, Marvell is building the ...

TL;DR: Apple is collaborating with TSMC to adopt advanced WMCM and SoIC packaging technologies for its next-generation A20 and server chips in 2026. These innovations enable ultra-dense chip stacking, ...

In recent days, Amkor Technology has drawn attention as analysts highlighted its role in supplying advanced semiconductor packaging and test services for fast-growing AI-focused chips, including CPUs, ...

Warpage of dies, redistribution layers, and interposers is a growing problem in multi-chiplet packages, and it can have a dramatic impact on the behavior and reliability of these devices. Multiple ...

The semiconductor companies and startups on the front lines of the AI chip market are competing over scale as much as anything else. They’re all racing to roll out giant graphics processing units ...

In the AI era, chip packaging has become critical for increasing compute density while effectively managing power, thermal dissipation, optical I/O, signal integrity, and other factors that impact the ...