The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...

Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

As system-on-chip designs migrate to nanometer silicon, packaging technology is challenged to keep pace with the integration and performance capabilities offered. Nowhere is this more so than in ...

Abstract: This application note discusses ways to help system designers apply proper layout techniques and signal routing. The layout and component descriptions will minimize noise pick-up and manage ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

Concurrent design of a chip and its packaging environment is becoming more important than ever for several reasons. Designing a large, high power die, e.g. a System-on-Chip (SoC), without considering ...

Solution integrates the Virtuoso platform with Allegro and Sigrity technologies to streamline overall design process and significantly improve productivity and cycle time SAN JOSE, Calif. , May. 30, ...

Sarcina Technology, a specialist in semiconductor and photonic package design, has announced advances in its photonic package design capabilities for Co-Packaged Optics (CPO). Photonic IC packaging ...