System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is ...

Far-field and radiating near-field are two options for high-volume over-the-air (OTA) testing of antenna-in-package (AiP) modules with automated test equipment (ATE) [1]. In this article, we define an ...

Copper interconnects cannot deliver the high-performance requirements of modern systems, especially with the rapid expansion ...

Traditional PV inspection methods using direct current polarisation have proved unreliable in detecting certain issues. Researchers from Enertis Applus+ detail a new approach to defect detection aimed ...

No automatic method exists to insert the different and multiple RLC package/PCB models of the Chip in Mix Mode (RTL + Spice) AMS verification. Such additions of components are inserted in simulation ...