What’s driving change: Rising power densities in AI, HPC, and 5G demand substrates with exceptional thermal conductivity and mechanical strength. Material innovations: Advances include diamond-copper ...

This fourth article in a six-part series highlights developments, innovations, trends, and research updates on wood ...

Glass substrates are gaining attention as a structural alternative to organic build-up films/cores in advanced semiconductor ...

The next course from the 2026 Greenhouse Training Online series is "Substrates for Container-Grown Plants," beginning on June ...

Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...

Atomic force microscopy (AFM) shows the surface of the TaC thin film before and after annealing at high temperatures. The initial film surface is composed of many columnar grains, whereas after ...

Intel has revealed more details today about its "breakthrough" glass substrate technology - a new way to manufacture processors that promises numerous benefits to todays standard organic substrate ...

The semiconductor industry's push toward advanced packaging has made wafer dicing the critical gatekeeper of yield, especially for ultra-thin wafers and complex copper pillar interconnects. In 2026, ...