One of the contributors to layer-to-layer overlay in today’s chip manufacturing process is wafer distortion due to thin film deposition. Mismatch in the film specific material parameters (e.g., ...
Chemical mechanical polishing (CMP) – also known as planarization – has long been the most commonly employed technique for smoothing and flattening wafer surfaces during the fabrication of ...
SAN JOSE — KLA-Tencor Corp. rolled out a new wafer inspection system, called the AIT XP, which the company says is capable of finding “killer” defects in 100-nm (0.10-micron) processes while providing ...
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