Separating semiconductor chips from a wafer is an important step in the backend of semiconductor manufacturing. The new process from Lidrotec combines ablative laser dicing under a liquid stream with ...
TAIPEI, Taiwan--(BUSINESS WIRE)--TrendForce reports that the three largest DRAM suppliers are increasing wafer input for advanced processes. Following a rise in memory contract prices, companies have ...
Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...
DRAM manufacturers continue to demand cost-effective solutions for screening and process improvement amid growing concerns over defects and process variability, but meeting that demand is becoming ...
BAY CITY, Mich. (AP) — The U.S. Department of Energy announced a conditional $544 million loan Thursday that would allow a Michigan semiconductor manufacturing plant to expand to make parts that can ...
NexWafe’s continuous, direct gas-to-wafer manufacturing process also minimizes waste, resulting in wafers that are less expensive than conventional wafers. NexWafe’s in-line, ultra-scalable process ...
Flexibility: Applied’s most significant new platform in more than a decade hosts an unprecedented wide variety of chamber types, sizes and configurations, from Applied and partners Intelligence: ...
The Wafer Process Control Equipment Market, valued at USD 7.93 billion in 2023, is expected to grow to USD 13.15 billion by 2031, exhibiting a CAGR of 6.52% from 2024 to 2031. This growth is driven by ...
Following reports that the US government had granted annual export licenses to South Korea's Samsung Electronics and SK Hynix, the US Department of Commerce (DOC) has also approved TSMC to export chip ...
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