Data doesn’t have to travel as far or waste as much energy when the memory and logic components are closer together.

The 3D stacking market size is expected to reach US$ 5.94 billion by 2031 from US$ 1.81 billion in 2023 to record a CAGR of 16.0% from 2023 to 2031. NEW YORK, Oct. 15, 2024 /PRNewswire/ -- According ...

To continue Moore's Law trend toward smaller, sleeker handset devices, designers can leverage advanced packaging and interconnect methods to meet the miniaturization requirements. PoP ...

This is the first article in a four-part series that explores using Intel HPC Orchestrator to solve HPC software stack management challenges. The complete report, available here, outlines some of ...

Smartwatches, fitness trackers, and other wearables benefit from 3D stacking by integrating multiple functionalities in a compact form factor, including sensors, processors, and memory. The reduced ...